Large-scale sputtering target processing
Leave the machining of various large sputtering targets such as silver, copper (6N), and tin (6N) to us!
Our "gantry machining center" equipment has a gate width of 2100mm, allowing for the processing of large sputtering targets for semiconductors (over Φ660mm) and for LCD manufacturing (up to 2000x4000mm). Additionally, it features NC control with multi-axis AI correction capabilities, ensuring high repeatability and enabling the use of 3D measurement functions on the machine to guarantee the precision of processed products for all units. It is suitable for processing lots of approximately 1000 pieces per month. Furthermore, we have built a track record of processing various materials such as tin, aluminum, and copper in collaboration with multiple partner factories. 【Examples of Implementation】 ■ Silver sputtering target cutting processing ■ Copper sputtering target cutting processing (6N) ■ Tin sputtering target cutting processing (6N) - All measurement data attached - Mass production support - Degreasing, packaging, and nationwide transportation support *For more details, please visit our website or feel free to contact us.
- 企業：埼玉プレーナー工業所 本社
- 価格：Other
